E aʻo i ka hoʻomākaukau ʻana a me ka hoʻohana ʻana i ka antistatic, antibacterial a me ka ʻala e hoʻoneʻe i ka wai epoxy floor coating.

2022-11-02

  Ma kēia haʻawina, wai maʻamau epoxy resin E51 hui pū ʻia me kahi ʻāpana kūpono o ka mea hoʻoheheʻe ikaika, ʻo ka cosolvent ka ʻāpana A, a ʻo ka mea B i haku ʻia me ka polyamide adduct curing agent, nā puaʻa a me nā mea hoʻopiha, nā mea hoʻohui, nā mea hoʻohui hana a me ka wai. ʻO ka ratio like o nā mea membrane o nā ʻāpana A a me B he 1.1 ∶ 1. Ma hope o ka hoʻōla ʻana, ʻoi aku ka ikaika o ke kiʻiʻoniʻoni, ʻoi aku ka maikaʻi o ka corrosion, ka paʻakikī kiʻekiʻe, ke kūpaʻa abrasion maikaʻi, ke kūpaʻa ikaika, ka hoʻonaninani maikaʻi, ka maʻemaʻe a me ka maʻalahi Breathable a me ka wai.


EPOXY RESIN E51

1. Hoʻomākaukau ʻana i ka uhi ʻana o ka papahele epoxy wai


a) Ke koho ʻana i nā mea maka


i. Ke koho ʻana i ka resin


  Waipuna epoxy floor coating is mainly composed of two components, namely hydrophobic epoxy resin and hydrophilic amine curing agent. Waterborne epoxy floor coating can be divided into two types: type I is composed of liquid epoxy resin with low relative molecular weight or its lotion and water-borne amine curing agent, and type II is composed of solid epoxy resin lotion with high relative molecular weight and water-borne amine curing agent. The waterborne epoxy floor coating prepared in this study belongs to Type I, and the liquid bisphenol A epoxy resin is selected as the epoxy resin.


  ʻO ka waiwai epoxy o ka epoxy resin E51 he haʻahaʻa, a ʻo kāna huahana i hoʻōla ʻia he kiʻekiʻe crosslinking density, compactness maikaʻi a me ke kūpaʻa ʻana i ka corrosion ikaika. He haʻahaʻa ka hana epoxy E51 (n = 0 ~ 1), haʻahaʻa hydroxyl content a me ke kūpaʻa wai maikaʻi. E nānā i ka Papa 1 no ka pilina ma waena o ka maʻiʻo hydroxyl i loko o ke kiʻiʻoniʻoni a me ka pale wai.


Ke 'ano o ka Epoxy Resin

Waiwai Hydroxyl

Mol/100g

Hydroxyl maʻiʻo i ka noi/mmol*g^-1

Kū'ē i ka wai hoʻoheheʻe

(25 ℃)

F44

0.49

6.65

30d Ua poino loa ka uhi

E44

0.10

3.79

90d Paʻa ke kiʻiʻoniʻoni

E20

0.32

4.42

30d Hoʻomaka ke kiʻiʻoniʻoni e haki

E51

0.08

3.97

90d Paʻa ke kiʻiʻoniʻoni

  Hiki ke ʻike ʻia mai ka Papa 1 ua koho ʻia ka wai epoxy resin E51 no kēia haʻawina e pili ana i ka lakio hoʻokō kumukūʻai a me ka paʻakikī o nā ala kūʻai.


ii. Ke koho ʻana i ka mea lahilahi


  ʻO ka mea hoʻoheheʻe ikaika i hoʻohana ʻia no ka bisphenol A epoxy resin he aliphatic glycidyl ether epoxy resin, hiki ke hana me ka lāʻau lapaʻau e hana i ka hui hoʻōla epoxy.


  I mea e hōʻemi ai i ka viscosity o ka wai epoxy resin E51, hoʻomaikaʻi i kona kūlike me ka wai wai amine curing agent, hoʻonui i ka emulsification o ka wai hoʻōla wai ma luna o ka resin, a ma ka manawa like ʻole e hōʻemi i ka hana piha o ka resin epoxy cured. , pono e hoʻohui i nā mea hoʻoheheʻe kūpono. ʻO nā koi no ka thinner: ① haʻahaʻa viscosity; ② He kiʻekiʻe ka waiwai epoxy; ③ Hoʻopili maikaʻi me ka resin epoxy; ④ maikaʻi hydrophilicity. Hōʻike ʻia nā waiwai nui o kekahi mau aliphatic glycidyl ethers maʻamau i ka Papa 2.


inoa

Epoxy waiwai eq/100g

Viscosity(25 ℃)

MPa*s

Hydrophilicity

Ethylene glycol diglycidyl ether

≥0.65

≤100

Maikaʻi loa

1,2-Propylene glycol diglycidyl etera

0.65 ~ 0.75

≤50

Maikaʻi loa

1,4-Butanediol diglycidyl ether

0.68 ~ 0.75

15 ~ 20

Maikaʻi loa


  Hiki ke ʻike ʻia mai ka Papa 2, ʻo ka waiwai epoxy a me ka hydrophilicity o nā mea hoʻoheheʻe ikaika ʻekolu he ʻano like, akā ʻo ka viscosity o 1,4-butanediol diglycidyl ether ka haʻahaʻa, no laila ua koho ʻia. I ka 10% ~ 15% o ka epoxy resin E51, hiki ke hoemiia ka viscosity o E51 epoxy resin mai 1500 MPa • s a i 600 MPa • s.


  I mea e hoʻomaikaʻi ai i ka launa ʻana o epoxy resin E51 me ka wai hoʻoheheʻe amine a hōʻemi i ka ʻokoʻa o nā ʻāpana solubility ma waena o nā ʻāpana ʻelua, pono e hoʻohui ʻia kahi ʻāpana latent cosolvent i ka ʻāpana A. No ka mea ke hui ʻia nā ʻāpana ʻelua A a me B no ka hoʻōla ʻana, komo ka mea hoʻōla hydrophilic i ka ʻili. o ka epoxy resin o ka mea i hoopuehuia mai ka aqueous phase, ka mea e hookiekie ae ai ka manao o ka mea hoola ma ka ili o ka epoxy resin a paa koke ka epoxy resin i loko o ka iwi paakiki. ʻO kēia ka mea e pale ai i nā ʻāpana mai ka hui ʻana i loko o kahi kiʻiʻoniʻoni, e hana i ka resin i loko o ke kiʻi pena e hoʻōla maikaʻi ʻole, pēlā e hōʻemi ai i ka hana o ke kiʻiʻoniʻoni. Ma lalo o ka hana hui o ka diluent a me ka cosolvent, hiki iā ia ke hoʻohaʻahaʻa i ka viscosity resin a me ka mahana hoʻololi aniani, hoʻomaikaʻi i ka hoʻohālikelike a me ka hoʻohālikelike ʻana me ka mea hoʻoponopono, a hoʻomaikaʻi pū i ka wettability, permeability a me ka diffusion o ka mea hoʻōla i ka resin, e hoʻoikaika i ka. hoʻomaʻamaʻa like ʻole o ka resin, a hoʻomaikaʻi i ka hana kiʻiʻoniʻoni. Ua hōʻoia ka hōʻike ʻoi aku ka maikaʻi o ke koho ʻana iā Tripropylene Glycol Methyl Ether (TPM) mai Dow Chemical Company o ʻAmelika Hui Pū ʻIa, me ke ʻano o ka 3% o ka resin epoxy.


  iii. Ke koho ʻana i ka lāʻau lapaʻau


  ʻO ka lāʻau lapaʻau i hoʻohana ʻia i ka uhi ʻana i ka papahele epoxy wai he amine hiki ke hoʻoheheʻe ʻia a i ʻole ka hoʻopuehu wai o amine, a hoʻohana nui ʻia ka amine wai-soluble i kēia manawa.


  No ke koho ʻana i ka wai-soluble amine curing agent, ʻaʻole wale kona reactivity, akā no ka hoʻohālikelike ʻana me ka resin epoxy, dispersion emulsification a me nā mea make. ʻO ka mea nui, pono e hoʻohana ʻia nā pūhui amine liʻiliʻi me ka akahele ma muli o ko lākou volatility a me nā mea ʻawaʻawa. No laila, hana pinepine ʻia ka polyamide a i ʻole amine addduct e like me ka curing agent e hoʻomaikaʻi ai i ka maikaʻi o ka amine a hōʻemi i ka ʻona. He ʻilihune ka miscibility o ka polyamide a me ka resin epoxy a aia kahi manawa induction. Hiki ke hoʻohana ʻia nā mea hoʻohui polyamide e hoʻoponopono i kēia pilikia. ʻO ka wai hoʻoheheʻe polyamide adduct curing agent he ʻōnaehana hoʻoheheʻe wai me nā hana ʻelua o ka lāʻau lapaʻau a me ka emulsifier ma ka hoʻokomo ʻana i nā ʻāpana kaulahao surfactant i loko o nā molekele lāʻau lapaʻau. ʻO ke kaʻina hana hoʻōla o ka wai epoxy resin coating he hopena a me ke kaʻina hoʻomalu diffusion, me ka hoʻoheheʻe ʻana o ka wai, ka coalescence particle, curing agent diffusion and curing crosslinking reaction. ʻO ka hoʻomaʻamaʻa ʻana o ka polyamide hiki ke hoʻohui i ka wai epoxy resin E51 lohi, hiki ke hana i ka mea i hoolaia; He haʻahaʻa kona ʻano hana, hiki ke hana i nā waiwai piha o nā huahana epoxy resin cured maikaʻi loa; He kūpono maikaʻi ia me ka ʻōnaehana resin epoxy, kahi i kūpono i ka hoʻopuʻi ʻana o nā molekole mea hoʻōla i loko o nā ʻāpana epoxy resin a me ka hoʻōla piha ʻana; Hiki ke hoʻonāwaliwali a hōʻole paha i ka hoʻokumu ʻana o ka pūpū paʻakikī o ka epoxy resin; Loaʻa iā ia ka pulu maikaʻi, a hiki ke ho'ōla ʻia e ka hoʻoheheʻe ʻana i ka wai, i hiki ke hoʻōla ʻia ma luna o ka ʻili kumu wai e hana i kahi kiʻiʻoniʻoni; Paʻa ka ʻōnaehana, me ka ʻole o ka wikiwiki wikiwiki a me ka demulsification. No laila, koho ʻia ka hoʻohui wai-soluble polyamide ma ke ʻano he lāʻau lapaʻau ma kēia haʻawina.


  iv. Ke koho ʻana i nā pigments a me nā mea hoʻopihapiha


  I loko o nā uhi papahele epoxy wai, nā puaʻa a me nā mea hoʻopihapiha he mea pono ʻole. ʻO ke kumu koho o nā puaʻa ʻo ia: nā ʻano me ka waiwai haʻahaʻa o ka ʻaila absorption, haʻahaʻa wai absorption, kiʻekiʻe paʻakikī, ka nui o nā ʻāpana maikaʻi, ke koʻikoʻi kūloko ikaika, ka waikawa maikaʻi a me ke kūpaʻa alkali, a me ke kūpaʻa maikaʻi loa. Ma keʻano laulā, ʻo ka ʻike o nā puaʻa a me nā mea hoʻopihapiha i loko o ka wai epoxy coatings he 30% ~ 38%, a pono e hōʻoia ʻia nā uhi ʻana i ka ea kūpono. No laila, pono e hoʻonui pono i ka ʻike o nā puaʻa a me nā mea hoʻopihapiha i ka wā e mālama ʻole ai i nā mea hana kiʻiʻoniʻoni. I mea e hōʻemi ʻole ai i ke kūʻē ʻana o ka wai a me ka pale ʻana i ka corrosion o ke kiʻiʻoniʻoni, he ala kūpono ia e koho ai i nā puaʻa ultra-fine a me nā mea hoʻopihapiha me ke kūpaʻa kemika maikaʻi a hoʻohui i ka mea hoʻolaha adhesion.


  v. Nā mea hoʻohui hana


  (1) ʻAiʻi antistatic. ʻO ka hapa nui o nā mea polymer e maʻalahi i ka hōʻiliʻili ʻana o nā uku static. ʻO kekahi o nā hopena maikaʻi ʻo ka hoʻohana ʻana i nā pale conductive e hāʻawi i ka conductivity surface film. ʻO nā pale antistatic i hoʻohana ʻia i kēia manawa he mau mea hoʻohui conductive. ʻO nā mea hoʻohui ① nā mea hoʻopiha conductive a ʻo ② nā mea hana ma luna.


  I loko o kēia uhi ʻana i ka papahele epoxy wai, koho ʻia ka polyaniline doped conductive polymer ma ke ʻano he anti-static filler. ʻO ka polyaniline doped me ka dodecyl sulfonate he conductivity maikaʻi loa a me ka pale ʻana i ka corrosion. Ma ke ʻano he pani no ka hoʻopihapiha conductive inorganic, ua hoʻopuehu ʻia i loko o ka resin epoxy i hoʻōla ʻia. Ke piʻi ka nui o ka polyaniline doped i 5%, hiki i ka resistivity o ka uhi ke hiki i 107 Ω• cm, hiki ke hoʻokō pono i nā koi maʻamau o nā pale anti-static, a he hopena lōʻihi. I ka manawa like, hiki iā ia ke hoʻomaikaʻi i ke kūpaʻa corrosion kemika o ka uhi.


  (2) Ion kino - mea hoʻohui antibacterial. ʻO Anion antibacterial additive kahi mea hana e hoʻohui i nā mea hana anion me nā mea antibacterial inorganic. Ma waena o lākou, ʻo nā mea hana anion wale nō nā mea polar kiʻekiʻe i hoʻopaʻa ʻia ma ke ʻano. Ma lalo o ka hauʻoli o ke kumu kukui ʻole, hana maoli lākou i kahi māla uila micro mau, a hana i ka anion hydroxyl ma o ka electrolysis nāwaliwali o kā lākou mau electrodes ma ka lewa a me ka wai. Hoʻopau ka anion hydroxyl a hoʻoneʻe i nā kinoea ʻino e like me formaldehyde, benzene a me ka amonia i ka lewa ma o ka neutralization uila, ka hopena kemika a me ka adsorption kino. Loaʻa iā ia nā hana o ka pale ʻana i ke ola ʻana o ka mold, wehe i ka ʻala a hoʻomaha i ka ea.


  vi. Ke koho ʻana i nā mea hoʻohui


  Pono ka uhi ʻana o ka papahele epoxy wai i nā mea hoʻohui like ʻole e hoʻoponopono ai i ka viscosity a i ʻole ka ʻili o ka ʻili o ka uhi, a ʻo ke koho ʻana i nā mea hoʻoheheʻe a me nā mea hoʻopuehu. I mea e hoʻomaikaʻi ai i ka wettability a me ka dispersibility o nā puaʻa a me nā mea hoʻopihapiha, hiki i ka hoʻokaʻawale ʻana o nā uku maikaʻi ʻole ke hoʻomaikaʻi i ka hoʻokuʻu paʻa ʻana o nā puaʻa a me nā mea hoʻopihapiha, hoʻemi i ka sedimentation a me ka agglomeration, hoʻonāwaliwali i ka hui ʻana ma waena o nā ʻāpana puaʻa, a pale i ka waihoʻoluʻu a me ka pua. Hiki ke loaʻa kahi ʻōnaehana hoʻopuehu paʻa ma ke koho ʻana iā ia iho emulsifying acetylene glycol non-ionic surface active agent SURFYNOL SE-F a me Shengwo FA182 dispersant.


  No ka hoʻoponopono ʻana i ka viscosity o ka uhi ʻana o ka papahele epoxy wai, koho ʻia ka mānoanoa pālolo i hoʻololi ʻia no ka hoʻoponopono. ʻO Detron VT-819 mānoanoa a me ka anti sedimentation agent ka hopena maikaʻi loa.


  ʻO ka defoamer e hana lōʻihi a kiʻekiʻe-efficiency non silicon defoamer, e like me SURFYNOL DF-75.


  b) Huina


  Kuhikuhi kumu o ka mea A:


  Epoxy resin E51: 85%; 1,4-Butanediol glycidyl ether: 12% ~ 13%; Cosolvent TMP: 2%~3%.


  Kuhikuhi kumu o ka mea B:


  Hoʻohui wai polyamide hiki ke hoʻohui ʻia: 30%; ʻO ka mea hoʻopuehu a me ka pulu: 0.6% ~ 0.7%; Defoamer: 0.3% ~ 0.4%; Mea hoʻolālā pae: 0.3% ~ 0.4%; 

  

  Mānoanoa: 0.05% ~ 0.08%; Mea hoʻomaikaʻi paheʻe: 1.0%~2.0%; ʻO ka polyaniline doped: 6% ~ 10%; ʻAʻohe ion antibacterial hoʻohui: 1.6% ~ 2.0%; Hoʻopili 

  

  luna: 0.5% ~ 1.0%; Rutile titanium dioxide: 10% ~ 12%; 600 mesh quartz pauka: 18% ~ 22%; 1000 ~ 1200 mesh talcum pauka: 5% ~ 8%; kalakala 

   paʻi: 2% ~ 3%; Ka wai: 16% ~ 20%.


  c) Ke Kaʻina Hoʻomākaukau


  Mahele A: e hoʻohui i ka resin epoxy wai, ka mea hoʻoheheʻe ikaika a me ka cosolvent o ke ʻano i loko o ka pahu hui pū, a hui pū me ka wikiwiki no 10-20 min ma mua o ka hoʻopili ʻana.


  Māhele B: e hoʻohui i ka wai i loko o ka pahu dispersion kiʻekiʻe, e hoʻohui i ka dispersant, ka mea hoʻomaʻemaʻe, ka ʻāpana o ka defoamer, ka mea hoʻonaninani, ka mea hoʻohui, ka polyaniline doped, ka mea antibacterial ion maikaʻi ʻole a me nā puaʻa a me nā mea hoʻopiha i ka wā o ka hui ʻana, hoʻopuehu i ka wikiwiki no 30 min , wili iā lākou i loko o ka slurry, e hoʻohui i ka lāʻau lapaʻau, plasticizer, thickener, waihoʻoluʻu paʻi a me ke koena defoamer, e hui like, a kānana iā lākou i loko o nā barela.


  2. Hana Hana


  Loaʻa i nā ʻoihana like ʻole nā ​​koi like ʻole no ka hana ʻana o ka papa hana papa hana, e pili ana i nā ʻokoʻa o nā ʻano hana. Ke hoʻohanaʻia ka wai epoxy coating e like me ka papahele o ka mīkini, kaʻoihana kemika, hale kūʻai a me nā hale hana'ē aʻe, ma muli o ka pono o ka hopena o ka hopena, ka'ōwili kū'ē, ke kū'ēʻana, ke kū'ē i ka corrosion, a me nā mea'ē aʻe o ka papahele, pono ke kūkuluʻia. hana ʻia e like me ke kaʻina hana maʻamau, ʻo ia hoʻi, ka mālama papa kumu → primer → epoxy mortar reinforcement layer → putty → hoʻopau.


  a) Ka mālama ʻana i ka papa kumu: no ka lepo lepo me ka nui o nā ʻaila ʻaila, hiki ke holoi ʻia me 10% ~ 15% hydrochloric acid solution, a laila holoi ʻia me ka wai maʻemaʻe; No ka papahele paʻa maʻamau me kahi ākea nui, hiki ke hoʻohana ʻia ke ʻano o ka wili ʻana me ka wili uila, ka wehe ʻana i ka lepo one a me ka ʻaila ʻaila.


  b) Hoʻopaʻa hope: ma hope o ka hui ʻana o nā ʻāpana A a me B o ka epoxy primer, e ʻōwili i ka pena ma ka ʻili o ka papa kumu. ʻOi aku ka maikaʻi o ka ʻōwili ʻana i ka pena i ʻelua manawa e pulu piha a komo i loko o ka ʻeke no ka hoʻopaʻa ʻana a me ka hoʻoikaika ʻana.


  c) Momo papa waena: hoʻohui i ka nui kūpono o ke one quartz hui ʻia me nā ʻāpana ʻāpana like ʻole i loko o ka uhi epoxy wai a hoʻoulu like. E hoʻohana i ke ʻano plastering e hiki ai i ka uhi ke hiki i kekahi mānoanoa, i mea e hoʻonui ai i ke kūpaʻa hopena a me ka pale ʻana o ka papahele.


  d) Putty: Ma hope o ka ho'ōla piha ʻia ʻana o ka papa mortar epoxy, e hoʻopili ʻia ʻelua mau papa o ka epoxy putty i hoʻokumu ʻia i ka wai, maloʻo a hoʻoliʻi ʻia e hāʻawi i kahi kahua paʻa a paʻa no ka uhi ʻana o ka ʻili.


  e) Ka uhi ʻana o ka ʻili: E hoʻohui like i ka pena wai epoxy e like me ka ratio nui o ka mea A: ʻāpana B = 1: 1, palaki a kāpī paha ma ka ʻili kumu no ka hoʻohaʻahaʻa ʻana iā ia iho, a ma hope o ka hoʻōla ʻana, e lilo ia i ʻāpana. palahalaha, lauwili a me ka multifunctional papahele me ka anti-static, corrosion resistant, antibacterial, bactericidal, odor removal, etc.

Ke hoʻohana ʻia ka epoxy coating wai no ka meaʻai, ka lāʻau lapaʻau, nā mea uila a me nā hale hana ʻē aʻe a i ʻole nā ​​​​wahi lehulehu, hiki ke hana ʻia ke kūkulu ʻana e like me ke kaʻina o ka mālama papa kumu → primer → putty → hoʻopau. ʻO ke ʻano hana o kēlā me kēia kaʻina hana e like me ka wā ma mua.


  I ke kūkulu ʻia ʻana, ʻoi aku ka nui o ka mahana ma mua o 12 ℃ a ma lalo o 40 ℃; 15 ~ 40 ℃ kūpono; Pono ka haʻahaʻa haʻahaʻa o ka ea ma lalo o 85%, ʻoi aku ka maikaʻi o 65%, i ʻole, ʻaʻole e hoʻōla maikaʻi ʻia ka uhi, e pili ana i ka hana piha o ka uhi.


  3. Panina


  ʻAʻole hoʻokō wale ka uhi ʻana o ka papahele epoxy wai i nā koi o ka mālama ʻana i ke kaiapuni, akā palekana nō hoʻi, ʻaʻohe mea ʻawaʻawa a me ka incombustible. He ma'alahi ka ho'oma'ema'e 'ana i nā mea hana hana me ka wai ma'ema'e, a hiki ke ho'ohana 'ia ma luna o ke kahua kahua pa'a malo'o a pulu. He adhesion pulu maikaʻi, adhesion maikaʻi loa ma waena o nā papa, hiki ke hoʻololi maikaʻi ʻia, ke kūpaʻa ikaika o ka hopena, ke kūpaʻa corrosion maikaʻi, ka maikaʻi o ka ea, a ʻaʻohe hopohopo e pili ana i ka hoʻokumu ʻana o nā blisters a me nā kiko keʻokeʻo. I ka manawa like, hiki ke hāʻawi ʻia ka hui curing epoxy me nā ʻano hana kūikawā ma o ka hoʻohui ʻana i nā mea hoʻohui hana.


  Ma kēia haʻawina, i ka ʻōnaehana hoʻōla o ka wai epoxy resin E51 a me ka wai-soluble polyamide, ma waho aʻe o ka hoʻohui ʻana i nā puaʻa, nā mea hoʻopiha a me nā mea hoʻohui maʻamau, ua hoʻohui pū ʻia ka doped polyaniline conductive polymer a me ka ion antibacterial additive. No laila, ua hāʻawi ʻia ka kiʻiʻoniʻoni me nā waiwai anti-static, antibacterial a me ka mildew, ka hoʻokuʻu ʻana i nā ion maikaʻi ʻole, a me ka hoʻopau ʻana i nā mea ʻino i ka lewa, e lilo i mea hou i ka wai epoxy floor coating. He mea kūpono ia no ka pena ʻana i nā papahele papa hana e pono ai ka maʻemaʻe, sterile a me ka anti-static, e like me ka lāʻau lapaʻau, uila, mea kani, textile, kemika i kēlā me kēia lā, meaʻai, a me nā mea ʻē aʻe. papahele.


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