Hoʻokaʻawale a koho ʻana i ka pā PCB maʻamau FR4

2021-12-07

FR-4-AE


  Pepa FR-4, kekahi o nā mea hoʻohana maʻamau, he helu helu o kahi mea pale ahi, ʻo ia hoʻi kahi kikoʻī kikoʻī e hiki ai i nā mea resin ke hoʻopau iā lākou iho. ʻAʻole inoa waiwai ka FR-4, akā he pae waiwai.


  Hoʻokaʻawale ʻia ʻo FR-4 i:

  FR-4 pāpaʻa paʻa, mānoanoa pā maʻamau 0.8-3.2mm;

  ʻO ka pā lahilahi FR-4, ʻoi aku ka mānoanoa o ka pā maʻamau ma mua o 0.78 mm.


  ʻO nā hōʻailona ʻenehana maʻamau o nā pepa FR-4: ka ikaika kulou, ka ikaika ʻili, ka hopena wela, ka hana ʻana o ka lapalapa ahi, ka nui o ke kūpaʻa ʻana, ka pale ʻana o ka ʻili, ka dielectric mau, ka huina dielectric nalowale, ke aniani hoʻololi wela Tg, dimensional stability Ke hoʻohana nei i ka mahana, warpage , etc.


Hoʻonui ʻike: ka hoʻokaʻawale ʻana i nā mea PCB


1, pani lole aniani: FR-4, FR-5


  ʻO ka ʻatikala i hoʻopili ʻia i ke ʻano o ka pā i hana ʻia e ka electronclock i hoʻolaʻa ʻia i loko o ka epoxy phenolic epoxy resin e hele ma waena o ka wela kiʻekiʻe, ke kaomi kiʻekiʻe, a me ka paʻi wela.


  Epoxy aniani pulupulu lole (i ike mau ia me: epoxide plate, aniani fiberboard, fiberboard, FR4). ʻO ka epoxy glass fiber non-substrate kahi papa o nā substrate no ka hoʻoikaika ʻana i nā mea me kahi resin epoxy.


  Epoxy aniani puluniu uhi keleawe pā ikaika, maikaʻi wela kū'ē, maikaʻi dielectric, substrate ma nā puka hiki ke metallized, ike kaapuni conduction ma waena o pālua-ʻaoʻao multilayer paʻi papa a me ka interlayer, epoxy aniani uhi keleawe pā He papa o ka loa pono hoʻohana ma. ke keleawe a pau.


2, pepa pani: FR-1, FR-2, FR-3, etc.


  ʻO ka substrate pepa phenolic he resin phenolic ma ke ʻano he mea hoʻopili e hoʻoikaika i nā mea ma ke ʻano he papa honua.


3, mea hoʻohuihui: CEM-1 a me CEM-3


  ʻO ia mau substrates ka nui o nā papa keleawe i uhi ʻia e ka CEM-1 (epoxy paper-based cores) a me CEM-3 (epoxy glass nonwoven core) ʻelua mau ʻano koʻikoʻi ma CEM. ʻO ka papa moʻo CEM he hana maikaʻi, palahalaha, kūpaʻa dimensional, pololei ka mānoanoa, kona ikaika mechanical, hana dielectric, mobility metala, a me nā mea ʻē aʻe, ʻoi aku ka kiʻekiʻe ma mua o ka substrate pepa, ʻoiai ka ikaika mechanical (CEM-3) A 80% o FR-4 , ua emi ke kumu kūʻai ma mua o ka papa FR-4.


4, substrate mea kūikawā (ceramic, metala, etc.)


hoouna aku