ʻIke kumu o ka epoxy resin a me ka epoxy adhesive

2024-01-24

   (1) Manao o Epoxy Resin

   

  ʻO ka resin epoxy ka huaʻōlelo maʻamau no nā pūhui polymer me kahi ʻano kaulahao polymer i loaʻa i ʻelua a ʻoi aku nā pūʻulu epoxy, nona nā resins thermosetting. ʻO ka resin epoxy ʻano bisphenol A ʻano.


   Epinxy resin

  

  (2) Nā hiʻohiʻona o Epoxy Resin (e pili ana i ka bisphenol A type epoxy resin)


  1. Haʻahaʻa ka waiwai hoʻohana ma ke ʻano he mea kūʻokoʻa; pono e hoʻohana pū me ka lāʻau lapaʻau e loaʻa ai ka waiwai kūpono.
  

  2. ʻO ka ikaika hoʻopaʻa kiʻekiʻe: ʻO ka epoxy resin adhesive ke kūlana kiʻekiʻe i ka ikaika hoʻopaʻa ma waena o nā mea hoʻopili synthetic.
  

  3. Haʻahaʻa curing shrinkage: Epoxy resin adhesive i ka liʻiliʻi liʻiliʻi i loko o nā adhesives, ʻo ia kekahi o nā kumu o kona ikaika hoʻopaʻa kiʻekiʻe.
  

  No ka laʻana: Phenolic resin adhesive: 8-10%; Organosilicon resin adhesive: 6-8%;
  

  Hoʻopili ka polyester resin: 4-8%; Epoxy resin adhesive: 1-3%
  

  Ma hope o ka hoʻololi ʻana, hiki ke hoʻemi ʻia ka shrinkage rate o ka epoxy resin adhesive i 0.1-0.3%, a ʻo ka coefficient o ka hoʻonui wela he 6.0 × 10-5 / ° C.

  

  4. Kūleʻa kemika maikaʻi: ʻAʻole hiki ke hoʻopau ʻia nā hui etera, nā apo benzene, a me nā pūʻulu aliphatic hydroxyl i loko o ka ʻōnaehana hoʻōla e ka waikawa a me ka alkali. Hiki ke ho'ohana 'ia no 'elua makahiki ma ka wai kai, ka aila, ka aila, 10% H2SO4, 10% HCl, 10% HAc, 10% NH3, 10% H3PO4, a me 30% Na2CO3; a hiki ke hoʻopaʻa 'ia no ka hapalua makahiki i loko o 50% H2SO4 a me 10% HNO3 ma ka lumi wela; hiki ke hoʻopaʻa 'ia no hoʻokahi mahina ma ka 10% NaOH (100°C) me ka hoʻololi ʻole o ka hana.
  

  5. Hoʻopili uila maikaʻi loa: Hiki ke ʻoi aku ka nui o ka haʻihaʻi o ka epoxy resin ma mua o 35kv / mm.
  

  6. Maikaʻi kaʻina hana, paʻa huahana ana, maikai kū'ē, a me ka haʻahaʻa wai absorption.

  He maikaʻi nā mea maikaʻi o ka bisphenol A type epoxy resin, akā loaʻa iā ia kona mau hemahema: ①. ʻO ka viscosity hana kiʻekiʻe, he mea kūpono ʻole i ke kūkulu ʻana. ②. ʻO nā mea i hoʻōla ʻia, haʻahaʻa elongation i ka wā haki. ③. Ka ikaika peel haʻahaʻa. ④. ʻAʻohe kūʻē i ka mechanical a me ka wela.

Waiwai Epoxy Resin

  (3) Hoʻohana a hoʻomohala ʻana o Epoxy Resin

  

  1. ʻO ka mōʻaukala hoʻomohala o ka resin epoxy: Ua hoʻopaʻa ʻia ka epoxy resin e P. Castam ma Switzerland i ka makahiki 1938. Ua hoʻomohala ʻia ka epoxy adhesive mua e Ciba Geigy i ka makahiki 1946, a ua hoʻomohala ʻia nā uhi epoxy e SO Creentee ma United States i 1949. Ua hoʻomaka ʻo Kina. hana ʻenehana o ka epoxy resin i ka makahiki 1958.


  2. Nā noi o ka epoxy resin:


  ① ʻOihana hoʻopili: ʻO ka epoxy resin ka mea nui loa i ka ʻoihana uhi. Ke hoʻohana nui ʻia nei nā mea hoʻoheheʻe wai, ka pauka, a me nā mea paʻa paʻa kiʻekiʻe. Hiki ke hoʻohana nui ʻia i nā ʻoihana e like me nā pipelines, nā kaʻa, nā moku, aerospace, electronics, toys, and crafts.


  ② ʻOihana uila a me ka uila: Hiki ke hoʻohana ʻia ka epoxy resin adhesive no nā mea hoʻonaninani uila, e like me ke sila a me ka impregnation o nā mea hoʻoponopono a me nā mea hoʻololi; ka hoʻopaʻa ʻana a me ka pale ʻana i nā mea uila; ka mālama ʻana a me ka hoʻopaʻa ʻana i nā huahana electromechanical; ka hoʻopaʻa ʻana a me ka hoʻopaʻa ʻana i nā pila; ka uhi ili o na capacitors, resistors, and inductors.


  ③ Lako, hana lima, a me ka ʻoihana waiwai haʻuki: Hiki ke hoʻohana ʻia i nā huahana e like me nā papa inoa, nā mea nani, nā hōʻailona, ​​nā lako, nā rackets, nā mea lawaiʻa, nā waiwai haʻuki, a me nā hana lima.


  ④ ʻOihana Optoelectronics: Hiki ke hoʻohana ʻia no ka encapsulation, potting, a me ka hoʻopaʻa ʻana o nā LED, nā paipu kikohoʻe, nā pika pika, nā hōʻike uila, a me nā huahana kukui LED.


  ⑤ ʻOihana hana: Hoʻohana nui ʻia i nā alanui, nā alahaka, nā papahele, nā hale kila, nā hale kūkulu hale, embankments, hana ʻenekinia, hoʻoponopono moʻomeheu moʻomeheu, etc.


  ⑥ Nā mea hoʻopili, nā mea hoʻopaʻa, a me nā mea i hui pū ʻia: Hoʻopaʻa i nā mea like ʻole e like me ka makani turbine blade, nā mea hana, nā seramika, nā aniani, ka hui ʻana o nā pepa kalapona kalapona, a me ka sila ʻana o nā mea microelectronic, etc.

 

  (4) Nā ʻano o ka Epoxy Adhesive


  1. Hoʻokumuʻia ka epoxy adhesive ma nāʻano o ka epoxy resin, a ua hoʻoponopono houʻia a hoʻololiʻia paha kona mau waiwai e kūpono i nā koi kūikawā. ʻO ka maʻamau, pono e hoʻohana ʻia ka epoxy adhesive me kahi mea hoʻōla, a pono e hui pū ʻia e hoʻōla piha. ʻO ka mea maʻamau, ua kapa ʻia ka epoxy adhesive ma ke ʻano he ʻāpana A a i ʻole kumu, a ua kapa ʻia ka mea hoʻōla ma ke ʻano he ʻāpana B a i ʻole ka mea hoʻōla (hardener).
 

  2. ʻO nā hiʻohiʻona nui o ka epoxy adhesive ma mua o ka hoʻōla ʻana, ʻo ia ka: kala, viscosity, gravity kikoʻī, ratio, ka manawa gel, ka manawa hana, ka manawa hoʻōla, thixotropy (thixotropy), paʻakikī, ʻili o ka ʻili, etc.


  Viscosity: ʻO ke kū'ē kū'ē kūloko i hana ʻia e nā colloids i ke kahe e hoʻoholo i kona waiwai ma muli o nā mea e like me ke ʻano o ka mea, ka mahana, a me ka ʻike.
  Ka manawa gel: ʻO ka manawa mai ka hoʻomaka ʻana o ka pane ʻana i ke kūlana koʻikoʻi i ka wā e paʻa ai ka colloid i ka wā o ka hoʻōla ʻana o ka adhesive e hoʻoholo ʻia e nā mea e like me ka nui o ka hui ʻana a me ka mahana o ka epoxy adhesive.
  Thixotropy: ʻO kēia hiʻohiʻona e pili ana i ke ʻano o ka liʻiliʻi ʻana o ka colloid ma lalo o ka ikaika o waho (ka haʻalulu, hoʻoulu ʻana, haʻalulu, ultrasonic, a me nā mea ʻē aʻe), a i ka wā e pau ai ka ikaika o waho, e hoʻi ka colloid i kona ʻano kūlike.
  Paʻakiki: ʻO ka hiki i kahi mea ke pale aku i nā ikaika o waho e like me ka indentation a me nā ʻōpala. Aia nā ʻano ʻokoʻa o ka paʻakikī ma muli o ke ʻano hoʻāʻo, ʻo ia hoʻi ʻo Shore hardness, Brinell hardness, Rockwell hardness, Mohs hardness, Barcol hardness, a me Vickers hardness.

  Ka ʻili o ka ʻili: ʻO ka huki ʻana o nā molekala i loko o ka wai e hana ai nā molekala ma luna o ka ʻili e pili ana i kahi ikaika e like me ka ʻili, e hōʻemi ana i ka ʻili o ka wai a hana i ka ikaika like me ka ʻili, i kapa ʻia ʻo ka ʻili o ka ʻili. A i ʻole, ʻo ia ka lōʻihi o ka ʻāpana o ka ikaika traction like ma waena o nā ʻāpana pili ma ka ʻili, he hōʻike ia o nā ikaika molekala. ʻO ka ʻāpana o ka ʻili o ka ʻili he N/m.


Epoxy Resin


  3. ʻO nā hiʻohiʻona nui o ka epoxy adhesive ma hope o ka hoʻōla ʻana, ʻo ia ka: kū'ē, ikaika dielectric, absorption wai, compressive strength, tensile strength, shear strength, peel strength, impact strength, heat distortion temperature, glass transition temperature, internal stress, chemical resistance, elongation i ka haʻihaʻi, shrinkage coefficient, thermal conductivity, dielectric mau, kū i ka wā, kūʻokoʻa kūʻokoʻa, etc.


  3.1 Kū'ē: Hōʻike i nā hiʻohiʻona pale uila o kahi mea, i hōʻike pinepine ʻia ma ke ʻano he pale ʻili a i ʻole ke kūpaʻa leo.


  3.2 Ka ikaika dielectric: Ua ʻike ʻia ʻo ia ka ikaika haʻihaʻi (ikaika insulation), ʻoi aku ka kiʻekiʻe o ka volta i hoʻopili ʻia i nā wēlau o ka mea hoʻopili, ʻoi aku ka nui o ka ikaika o ke kahua uila i ʻike ʻia e nā koina i loko o ka mea, e maʻalahi ai ka hoʻopili ʻana i lalo. ʻO ka haʻahaʻa haʻahaʻa e hoʻohaʻahaʻa i ka insulation i kapa ʻia ʻo ka haʻihaʻi voltage o ka mea. Ke wāwahi ʻia kahi mea hoʻokaʻawale 1 mm mānoanoa, ua kapa ʻia ka volta i koi ʻia ʻo ka ikaika wāwahi insulation, ʻike ʻia hoʻi ʻo ka ikaika dielectric, ma nā ʻāpana o kV/mm. ʻO ka hana insulation o nā mea insulating e pili kokoke ana i ka mahana. ʻO ke kiʻekiʻe o ka mahana, ʻoi aku ka maikaʻi o ka hana insulation o ka mea insulating. No ka hōʻoia ʻana i ka ikaika insulation, loaʻa i kēlā me kēia ʻano mea insulating kahi mahana hana kūpono loa i ʻae ʻia, ma lalo e hiki ke hoʻohana palekana ʻia no ka manawa lōʻihi, a ma waho aʻe o ia e wikiwiki ai ka makahiki.


  3.3 Ka hoʻomoʻa ʻana i ka wai: ʻO ke ana o ke ʻano o ka ʻai ʻana o ka wai i ka wai. E pili ana ia i ka pākēneka o ka piʻi ʻana o ka nuipaʻa i ka wā i hoʻomoʻi ʻia ai kekahi mea i ka wai no kekahi manawa ma kahi mahana.


  3.4 ʻO ka ikaika tensile: ʻO ke koʻikoʻi nui loa i ka wā e hoʻopili ʻia ai ka mea hoʻopili a hiki i ka haki. ʻIke ʻia hoʻi ʻo ka ikaika waimaka, ka ikaika tensile, ke kūpaʻa ʻana i ka ʻāʻī, a i ʻole ka ikaika tensile. Huina: MPa.


  3.5 Ka ikaika shear: ʻIke ʻia hoʻi ʻo ka shear resistance, pili ia i ka haʻawe kiʻekiʻe loa e hiki ke amo i kēlā me kēia ʻāpana e like me ka wahi paʻa. ʻO ka ʻāpana maʻamau i hoʻohana ʻia ʻo MPa.


Ka ikaika Peel: ʻIke ʻia hoʻi ʻo ka pale ʻili, pili ia i ka haʻahaʻa hoʻopōʻino kiʻekiʻe i kēlā me kēia ʻāpana laula, kahi e ana i ka hiki ke pale aku i nā ikaika laina. ʻO ka ʻāpana kN/m.


  3.6 Elongation: ʻO ka hoʻonui ʻana i ka lōʻihi o ka colloid ma lalo o ke koʻikoʻi tensile, i hōʻike ʻia ma ke ʻano he pākēneka o ka lōʻihi kumu.


  3.7 Heat deflection wela: He ana o ka wela o ka mea i hoolaia. ʻO ia ka mahana kahi i hoʻokomo ʻia ai ka hāpana hoʻāʻo i loko o kahi mea hoʻololi wela kūpono me ka helu hoʻomehana mau, ma lalo o ka hana a ka beam static bending haawe i kākoʻo wale ʻia, hiki i ka deformation kulou i ʻōlelo ʻia, ʻike ʻia ʻo ka wela deflection wela, i hoʻopau ʻia ʻo HDT .


  ʻO ka mahana hoʻololi aniani: ʻO ke ʻano wela haiki o ka hoʻololi ʻana o ka mea i hoʻōla ʻia mai kahi ʻano aniani i kahi kūlana amorphous a i ʻole elastic nui a wai paha (a i ʻole ka hoʻololi hope ʻana), e pili ana i ka waena waena, i ʻike ʻia ʻo ke aniani hoʻololi ʻana i ke aniani, ka mea maʻamau i kapa ʻia ʻo Tg , he hōʻailona o ka pale wela.


  3.8 Lakiō hoʻemi: Ua wehewehe ʻia e like me ka pākēneka o ka nui o ka hōʻemi ʻana i ka nui kumu ma mua o ka emi ʻana, kahi o ka hōʻemi ʻana ka ʻokoʻa ma waena o ka nui ma mua a ma hope o ka emi ʻana.


  3.9 ʻO ke koʻikoʻi o loko: E pili ana i ke koʻikoʻi i hana ʻia i loko o ka colloid (material) ma muli o nā kumu e like me nā hemahema, nā hoʻololi ʻana o ka mahana, ka hana solvent, a me nā mea ʻē aʻe, me ka ʻole o ka ikaika o waho.


  3.10 Ke kū'ē kemika: ʻO ka hiki ke pale aku i nā ʻakika, alkalis, paʻakai, solvents, a me nā kemika ʻē aʻe.


  3.11 Ka pale ʻana i ke ahi: ʻO ka hiki i kahi mea ke pale aku i ka puhi ʻana ke hoʻopili ʻia me kahi lapalapa, a i ʻole ke kāohi ʻana i ka hoʻomau ʻia ʻana o ke ahi ke wehe ʻia mai ka lapalapa.


  3.12 Hiki i ka wā: Ka hiki i kahi mea ke kū i ka ʻike ʻana i nā kūlana e like me ka lā, nā ʻano wela, ka makani, a me ka ua.


  3.13 Ka ʻelemakule: He ʻano o nā hoʻololi kino a i ʻole kemika i hana ʻia i loko o ka colloid (material) i ka wā o ka hana ʻana, mālama ʻana, a me ka hoʻohana ʻana, ma muli o ka hana o nā mea o waho (wela, māmā, oxygen, wai, radiation, ikaika mechanical, media kemika, etc.), ka hopena o ka crosslinking, embrittlement, cracking, discoloration, roughening, foaming, chalking, delamination, deterioration lohi o ka hana, a me ka hopena o ka lilo ʻana o nā waiwai mechanical, no laila hiki ʻole ke hoʻohana. Kapa ʻia kēia ʻano he ʻelemakule.


  3.14 Dielectric mau: ʻike pū ʻia ʻo capacitance, permittivity. Hōʻike ia i ka nui o ka "ʻike uila static" hiki ke mālama ʻia i kēlā me kēia "unit volume" o kahi mea ma lalo o ka "unit potential gradient". ʻOi aku ka nui o ka "dielectric mau" o ka colloid (e hōʻike ana i ka maikaʻi ʻilihune), a i ka wā e hana nei i nā conductors pili ʻelua, ʻoi aku ka paʻakikī o ka hoʻokō ʻana i ka insulation piha, ʻo ia hoʻi, ʻoi aku ka maʻalahi o ka hana ʻana i kahi degere o ka leakage. No laila, ʻoi aku ka liʻiliʻi o ka dielectric mau o nā mea insulating ma lalo o nā kūlana maʻamau. ʻO ka dielectric mau o ka wai he 70, a hiki i ka wai liʻiliʻi ke hoʻololi nui.

 

  4. Ka hapanui epoxy ʻO nā adhesives he thermosetting adhesives, a loaʻa iā lākou nā hiʻohiʻona nui: ʻoi aku ka kiʻekiʻe o ka mahana, ʻoi aku ka wikiwiki o ka hoʻōla ʻana; ʻo ka hui pū ʻana i ka hele hoʻokahi, ʻoi aku ka wikiwiki o ka hoʻōla ʻana; aia kekahi hanana exothermic i ka wā o ka hoʻōla ʻana, etc.


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